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Thermal and stress analysis for electronic devices ASU/ISTR

Analyze electronic device-specific issues such as heat diffusion of the casing, substrate stress, and vibration resistance using FrontISTR.

ASU/ISTR is a dedicated pre-post integrated environment for FrontISTR that can perform a wide range of analyses essential for electronic device design, such as thermal distribution analysis, enclosure rigidity evaluation, and vibration characteristic confirmation. It streamlines the preparation for analysis from CAD data, allowing for smooth detailed evaluation of electronic enclosures. 【Features】 - Supports composite model analysis of substrates, enclosures, and internal components - A workflow that allows for consistent thermal and structural analysis - Automatic mesh generation that adapts to the complex part segmentation of electronic devices - A solver available for free commercial use, enabling high-density models without additional costs - A basic material database that handles isotropic and anisotropic materials - GUI functions can be added to align with in-house analysis methods - FrontISTR development members can respond to advanced needs such as adding special routines